Copper and nickel uptake, accumulation and tolerance in Typha latifolia with and without iron plaque on the root surface
The effects of iron plaque on the growth of Typha latifolia L. and accumulation of copper and nickel in T. latifolia were investigated under laboratory conditions in nutrient solution cultures. Seedlings with and without iron plaque on their roots were exposed to 0.05 μg ml-1 Cu and 0.10 μg ml-1 Ni...
| Veröffentlicht in: | The New phytologist. - 1979. - 136(1997), 3 vom: 18. Juli, Seite 481-488 |
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| Weitere Verfasser: | , , |
| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
1997
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| Zugriff auf das übergeordnete Werk: | The New phytologist |
| Schlagworte: | Journal Article Copper uptake Typha latifolia iron plaque metal tolerance nickel uptake |
| Online verfügbar |
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