Theoretical Study on the Adhesion Interaction between Epoxy Resin Including Curing Agent and Plated Gold Surface
In this study, the adhesive interaction between gold and epoxy resin is theoretically investigated. These materials make up crucial components of a wide range of electronic devices. The objectives of the study are (1) to elucidate the bonding mechanism between epoxy resin and a realistic gold surfac...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1999. - 37(2021), 13 vom: 06. Apr., Seite 3982-3995
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| 1. Verfasser: |
Tsuji, Yuta
(VerfasserIn) |
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| Weitere Verfasser: |
Baba, Taiki,
Tsurumi, Naoaki,
Murata, Hiroyuki,
Masago, Noriyuki,
Yoshizawa, Kazunari |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2021
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article |
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