Comprehensive characterization of TSV etching performance with phase-contrast X-ray microtomography
Comprehensive evaluation of through-silicon via (TSV) reliability often requires deterministic and 3D descriptions of local morphological and statistical features of via formation with the Bosch process. Here, a highly sensitive phase-contrast X-ray microtomography approach is presented based on rec...
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Bibliographische Detailangaben
| Veröffentlicht in: | Journal of synchrotron radiation. - 1994. - 27(2020), Pt 4 vom: 01. Juli, Seite 1023-1032
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| 1. Verfasser: |
Li, Ke
(VerfasserIn) |
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| Weitere Verfasser: |
Deng, Biao,
Zhang, Haipeng,
Yu, Fucheng,
Xue, Yanling,
Xie, Changqing,
Ye, Tianchun,
Xiao, Tiqiao |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2020
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| Zugriff auf das übergeordnete Werk: | Journal of synchrotron radiation
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| Schlagworte: | Journal Article
3D integration
TSV etching
X-ray microtomography
phase contrast |
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