Co-Integrated PIN-PMN-PT 2-D Array and Transceiver Electronics by Direct Assembly Using a 3-D Printed Interposer Grid Frame

Tiled modular 2-D ultrasound arrays have the potential for realizing large apertures for novel diagnostic applications. This work presents an architecture for fabrication of tileable 2-D array modules implemented using 1-3 composites of high-bandwidth (BW) PIN-PMN-PT single-crystal piezoelectric mat...

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Veröffentlicht in:IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 67(2020), 2 vom: 02. Feb., Seite 387-401
1. Verfasser: Wodnicki, Robert (VerfasserIn)
Weitere Verfasser: Kang, Haochen, Chen, Ruimin, Cabrera-Munoz, Nestor E, Jung, Hayong, Jiang, Laiming, Foiret, Josquin, Liu, Yu, Chiu, Victoria, Stephens, Douglas N, Zhou, Qifa, Ferrara, Katherine W
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2020
Zugriff auf das übergeordnete Werk:IEEE transactions on ultrasonics, ferroelectrics, and frequency control
Schlagworte:Journal Article
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520 |a Tiled modular 2-D ultrasound arrays have the potential for realizing large apertures for novel diagnostic applications. This work presents an architecture for fabrication of tileable 2-D array modules implemented using 1-3 composites of high-bandwidth (BW) PIN-PMN-PT single-crystal piezoelectric material closely coupled with high-voltage CMOS application-specific integrated circuit (ASIC) electronics for buffering and multiplexing functions. The module, which is designed to be operated as a λ -pitch 1.75-D array, benefits from an improved electromechanical coupling coefficient and increased Curie temperature and is assembled directly on top of the ASIC silicon substrate using an interposer backing. The interposer consists of a novel 3-D printed acrylic frame that is filled with conducting and acoustically absorbing silver epoxy material. The ASIC comprises a high-voltage switching matrix with locally integrated buffering and is interfaced to a Verasonics Vantage 128, using a local field programmable gate array (FPGA) controller. Multiple prototype 5 ×6 element array modules have been fabricated by this process. The combined acoustic array and ASIC module was configured electronically by programming the switches to operate as a 1-D array with elements grouped in elevation for imaging and pulse-echo testing. The resulting array configuration had an average center frequency of 4.55 MHz, azimuthal element pitch of [Formula: see text], and exhibited average -20-dB pulsewidth of 592 ns and average -6-dB fractional BW of 77% 
650 4 |a Journal Article 
700 1 |a Kang, Haochen  |e verfasserin  |4 aut 
700 1 |a Chen, Ruimin  |e verfasserin  |4 aut 
700 1 |a Cabrera-Munoz, Nestor E  |e verfasserin  |4 aut 
700 1 |a Jung, Hayong  |e verfasserin  |4 aut 
700 1 |a Jiang, Laiming  |e verfasserin  |4 aut 
700 1 |a Foiret, Josquin  |e verfasserin  |4 aut 
700 1 |a Liu, Yu  |e verfasserin  |4 aut 
700 1 |a Chiu, Victoria  |e verfasserin  |4 aut 
700 1 |a Stephens, Douglas N  |e verfasserin  |4 aut 
700 1 |a Zhou, Qifa  |e verfasserin  |4 aut 
700 1 |a Ferrara, Katherine W  |e verfasserin  |4 aut 
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