Solvent-Dependent Adhesion Strength of Electroless Deposited Ni-P Layer on an Amino-Terminated Silane Compound-Modified Si Wafer
Amino-terminated silane compound modification was wet-processed on a silicon wafer using four different solvents to investigate the property of the self-assembled monolayer (SAM) and its influence on the adhesion of electroless deposited nickel-phosphorus (Ni-P) films. Analyzed by various tools incl...
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1999. - 34(2018), 45 vom: 13. Nov., Seite 13597-13602 |
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| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2018
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids |
| Schlagworte: | Journal Article Research Support, Non-U.S. Gov't |
| Online verfügbar |
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