Backward-Mode Photoacoustic Imaging Using Illumination Through a CMUT With Improved Transparency
In this paper, we describe a capacitive micromachined ultrasonic transducer (CMUT) with improved transparency for photoacoustic imaging (PAI) with backside illumination. The CMUT was fabricated on a glass substrate with indium-tin oxide bottom electrodes. The plate was a 1.5- silicon layer formed ov...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 65(2018), 1 vom: 28. Jan., Seite 85-94
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| 1. Verfasser: |
Zhang, Xiao
(VerfasserIn) |
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| Weitere Verfasser: |
Wu, Xun,
Adelegan, Oluwafemi Joel,
Yamaner, Feysel Yalcin,
Oralkan, Omer |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2018
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| Zugriff auf das übergeordnete Werk: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Schlagworte: | Journal Article
Research Support, N.I.H., Extramural
Research Support, U.S. Gov't, Non-P.H.S.
Silicon Compounds
Indocyanine Green
IX6J1063HV
silicon nitride
QHB8T06IDK |
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