Formation of Micrometer Scale Metal Structures on Glass by Selective Electroless Plating on Photopatterned Titanium and Copper Containing Films
A procedure for formation of catalytic SiO2 substrate adhesive layer patterns and selective electrochemical metal deposition on the catalyst images was investigated. A photoreactive solution containing a diazonaphthoquinone sulfonate ester and Ti and Cu complexes was developed to deposit Cu catalyst...
Ausführliche Beschreibung
Bibliographische Detailangaben
Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 33(2017), 51 vom: 26. Dez., Seite 14571-14579
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1. Verfasser: |
Cordonier, Christopher E J
(VerfasserIn) |
Weitere Verfasser: |
Okabe, Kyohei,
Horiuchi, Yoshio,
Nakamura, Akimasa,
Ishikawa, Kaoru,
Seino, Shozo,
Takagi, Shinsuke,
Honma, Hideo |
Format: | Online-Aufsatz
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Sprache: | English |
Veröffentlicht: |
2017
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Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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Schlagworte: | Journal Article
Research Support, Non-U.S. Gov't |