System dynamics research of remanufacturing closed-loop supply chain dominated by the third party

With the rapid development of the electronic information industry in recent years, electronic products are being updated faster and faster, and e-waste recycling has become a common problem around the world. Firstly, this article contrasts recycling at home and abroad using the predicament of Midea...

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Veröffentlicht in:Waste management & research : the journal of the International Solid Wastes and Public Cleansing Association, ISWA. - 1991. - 35(2017), 4 vom: 18. Apr., Seite 379-386
1. Verfasser: Miao, Shidi (VerfasserIn)
Weitere Verfasser: Wang, Tengfei, Chen, Deyun
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2017
Zugriff auf das übergeordnete Werk:Waste management & research : the journal of the International Solid Wastes and Public Cleansing Association, ISWA
Schlagworte:Journal Article Closed-loop supply chain e-waste recycling mode remanufacturing system dynamics third-party leading
Beschreibung
Zusammenfassung:With the rapid development of the electronic information industry in recent years, electronic products are being updated faster and faster, and e-waste recycling has become a common problem around the world. Firstly, this article contrasts recycling at home and abroad using the predicament of Midea Corp. Based on a closed-loop supply chain with the system dynamics method, a model is constructed and simulated. In this model, the collection point coverage rate is introduced to adjust the e-waste recycling rate dynamically. Aiming at a recycling mode dominated by the third party of the closed-loop supply chain, the article mainly discusses the impact on the sales rate and market share of the recycling model by third-party enterprises and compares the total revenue of all supply chains. Simulation results show that the model is more effective and optimal than the traditional recycling model
Beschreibung:Date Completed 14.07.2017
Date Revised 14.07.2017
published: Print-Electronic
Citation Status MEDLINE
ISSN:1096-3669
DOI:10.1177/0734242X16684384