Ultrarobust Thin-Film Devices from Self-Assembled Metal-Terpyridine Oligomers

Ultrarobust Thin-Film Devices from Self-Assembled Metal-Terpyridine Oligomers

© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 28(2016), 18 vom: 28. Mai, Seite 3473-80
1. Verfasser: Karipidou, Zoi (VerfasserIn)
Weitere Verfasser: Branchi, Barbara, Sarpasan, Mustafa, Knorr, Nikolaus, Rodin, Vadim, Friederich, Pascal, Neumann, Tobias, Meded, Velimir, Rosselli, Silvia, Nelles, Gabriele, Wenzel, Wolfgang, Rampi, Maria Anita, von Wrochem, Florian
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2016
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Research Support, Non-U.S. Gov't Schottky contacts large-area junctions molecular electronics thermionic emission thin-film devices transition-metal complexes
Beschreibung
Zusammenfassung:© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
Ultrathin molecular layers of Fe(II) -terpyridine oligomers allow the fabrication of large-area crossbar junctions by conventional electrode vapor deposition. The junctions are electrically stable for over 2.5 years and operate over a wide range of temperatures (150-360 K) and voltages (±3 V) due to the high cohesive energy and packing density of the oligomer layer. Electrical measurements reveal ideal Richardson-Shottky emission in surprising agreement with electrochemical, optical, and photoemission data
Beschreibung:Date Completed 17.07.2018
Date Revised 30.09.2020
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201504847