Kinetic and thermodynamic studies on removal of Cu(II) from aqueous solutions using soil nanoclays
Soil clays (< 2,000 nm) (SC) and soil nanoclays (< 100 nm) (SNC) were used as adsorbents for removal of Cu(II) from aqueous solution. The experiments were conducted with variables including pH, interaction time, concentration of Cu(II) and temperature. Four kinetic models have been employed to...
| Veröffentlicht in: | Water environment research : a research publication of the Water Environment Federation. - 1998. - 87(2015), 1 vom: 02. Jan., Seite 88-95 |
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| 1. Verfasser: | |
| Weitere Verfasser: | , , , , , , |
| Format: | Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2015
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| Zugriff auf das übergeordnete Werk: | Water environment research : a research publication of the Water Environment Federation |
| Schlagworte: | Journal Article Research Support, Non-U.S. Gov't Aluminum Silicates Soil Copper 789U1901C5 Clay T1FAD4SS2M |
| Zusammenfassung: | Soil clays (< 2,000 nm) (SC) and soil nanoclays (< 100 nm) (SNC) were used as adsorbents for removal of Cu(II) from aqueous solution. The experiments were conducted with variables including pH, interaction time, concentration of Cu(II) and temperature. Four kinetic models have been employed to investigate adsorption mechanisms, and the experimental data more closely resemble a second-order process of the kinetic model. Adsorption studies on soil nanoclays have been shown to be highly effective in removing of Cu(II) from aqueous solution. This adsorbent is widely available as a natural material, is mechanically stable and, most importantly, it is environmentally appealing. The maximum Cu(II) adsorption capacity of soil nanoclays (31.7 mg/g) is more than three times higher than natural soil clays (10.2 mg/g). Our study demonstrates that soil nanoclays can be used effectively for removal of Cu(II) from aqueous systems to achieve environmental cleaning purposes |
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| Beschreibung: | Date Completed 24.02.2015 Date Revised 23.09.2019 published: Print Citation Status MEDLINE |
| ISSN: | 1554-7531 |