A vapor-phase deposited polymer film to improve the adhesion of electroless-deposited copper layer onto various kinds of substrates
The adhesion of electrodeposited metal film to polymeric circuit board substrate is one of the key elements to successful miniaturization of electronic devices. However, as the size of the circuit pattern continuously decreases, a novel method is urgently required to increase the adhesion of the met...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 30(2014), 3 vom: 28. Jan., Seite 916-21
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| 1. Verfasser: |
You, Jae Bem
(VerfasserIn) |
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| Weitere Verfasser: |
Kim, Shin Young,
Park, Yong Jin,
Ko, Young Gwan,
Im, Sung Gap |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2014
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article |
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