Electrically conductive gold- and copper-metallized DNA origami nanostructures
This work demonstrates the use of a circuit-like DNA origami structure as a template to fabricate conductive gold and copper nanostructures on Si surfaces. We improved over previous results by using multiple Pd seeding steps to increase seed uniformity and density. Our process has also been characte...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 29(2013), 10 vom: 12. März, Seite 3482-90
|
|---|
| 1. Verfasser: |
Geng, Yanli
(VerfasserIn) |
|---|
| Weitere Verfasser: |
Pearson, Anthony C,
Gates, Elisabeth P,
Uprety, Bibek,
Davis, Robert C,
Harb, John N,
Woolley, Adam T |
|---|
| Format: | Online-Aufsatz
|
|---|
| Sprache: | English |
|---|
| Veröffentlicht: |
2013
|
|---|
| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
|
|---|
| Schlagworte: | Journal Article
Research Support, U.S. Gov't, Non-P.H.S.
Gold
7440-57-5
Copper
789U1901C5 |
|---|