Formation of palladium nanofilms using electrochemical atomic layer deposition (E-ALD) with chloride complexation
Pd thin films were formed by electrochemical atomic layer deposition (E-ALD) using surface-limited redox replacement (SLRR) of Cu underpotential deposits (UPD) on polycrystalline Au substrates. An automated electrochemical flow deposition system was used to deposit Pd atomic layers using a sequence...
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Détails bibliographiques
| Publié dans: | Langmuir : the ACS journal of surfaces and colloids. - 1985. - 29(2013), 5 vom: 05. Feb., Seite 1592-600
|
| Auteur principal: |
Sheridan, Leah B
(Auteur) |
| Autres auteurs: |
Gebregziabiher, Daniel K,
Stickney, John L,
Robinson, David B |
| Format: | Article en ligne
|
| Langue: | English |
| Publié: |
2013
|
| Accès à la collection: | Langmuir : the ACS journal of surfaces and colloids
|
| Sujets: | Journal Article
Research Support, U.S. Gov't, Non-P.H.S.
Chlorides
Palladium
5TWQ1V240M
Gold
7440-57-5
Copper
789U1901C5 |