Solution processed aluminum paper for flexible electronics
As an alternative to vacuum deposition, preparation of highly conductive papers with aluminum (Al) features is successfully achieved by the solution process consisting of Al precursor ink (AlH(3){O(C(4)H(9))(2)}) and low temperature stamping process performed at 110 °C without any serious hydroxylat...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 28(2012), 36 vom: 11. Sept., Seite 13127-35
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| 1. Verfasser: |
Lee, Hye Moon
(VerfasserIn) |
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| Weitere Verfasser: |
Lee, Ha Beom,
Jung, Dae Soo,
Yun, Jung-Yeul,
Ko, Seung Hwan,
Park, Seung Bin |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2012
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article
Research Support, Non-U.S. Gov't
Organometallic Compounds
Solutions
Aluminum
CPD4NFA903 |
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