A novel solution-stamping process for preparation of a highly conductive aluminum thin film

Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Bibliographische Detailangaben
Veröffentlicht in:Advanced materials (Deerfield Beach, Fla.). - 1998. - 23(2011), 46 vom: 08. Dez., Seite 5524-8
1. Verfasser: Lee, Hye Moon (VerfasserIn)
Weitere Verfasser: Choi, Si-Young, Kim, Kyung Tae, Yun, Jung-Yeul, Jung, Dae Soo, Park, Seung Bin, Park, Jongwook
Format: Online-Aufsatz
Sprache:English
Veröffentlicht: 2011
Zugriff auf das übergeordnete Werk:Advanced materials (Deerfield Beach, Fla.)
Schlagworte:Journal Article Research Support, Non-U.S. Gov't Calcium Compounds Oxides Polyethylene Terephthalates Solutions Lavsan 25038-59-9 soda lime 4RG4VJM6VG mehr... Sodium Hydroxide 55X04QC32I Aluminum CPD4NFA903
Beschreibung
Zusammenfassung:Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.
A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated
Beschreibung:Date Completed 26.03.2012
Date Revised 30.09.2020
published: Print-Electronic
Citation Status MEDLINE
ISSN:1521-4095
DOI:10.1002/adma.201102805