A study on the recycling of scrap integrated circuits by leaching
In order to minimize the problem of pollution and to conserve limited natural resources, a method to recover the valuable metals such as gold, silver and copper) present in the scrap integrated circuits (ICs) was developed in the present study. Roasting, grinding, screening, magnetic separation, mel...
| Veröffentlicht in: | Waste management & research : the journal of the International Solid Wastes and Public Cleansing Association, ISWA. - 1991. - 29(2011), 7 vom: 28. Juli, Seite 677-85 |
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| Weitere Verfasser: | , |
| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2011
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| Zugriff auf das übergeordnete Werk: | Waste management & research : the journal of the International Solid Wastes and Public Cleansing Association, ISWA |
| Schlagworte: | Evaluation Study Journal Article Research Support, Non-U.S. Gov't Metals Silver 3M4G523W1G Gold 7440-57-5 Copper 789U1901C5 mehr... |
| Zusammenfassung: | In order to minimize the problem of pollution and to conserve limited natural resources, a method to recover the valuable metals such as gold, silver and copper) present in the scrap integrated circuits (ICs) was developed in the present study. Roasting, grinding, screening, magnetic separation, melting and leaching were adopted to investigate the efficiency of recovery of gold, silver and copper from scrap ICs. The collected scrap IC samples were roasted at 850 °C to destroy their plastic resin sealing material, followed by screening and magnetic separation to separate the metals from the resin residue. The non-ferrous materials (0.840 mm) were mainly composed of copper and could be melted into a copper alloy. Non-ferrous materials containing gold (860.05 ppm), silver (1323.12 ppm) and copper (37259.7 ppm) (size less than 50 mesh) were recovered 100% by a leaching process and thiourea was used as a leaching reagent |
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| Beschreibung: | Date Completed 26.09.2011 Date Revised 10.12.2019 published: Print-Electronic Citation Status MEDLINE |
| ISSN: | 1096-3669 |
| DOI: | 10.1177/0734242X10380995 |