Molecular-scale change in the surface properties of silica and copper in pure water with time
We aimed to understand one of the fundamentals of how silica and copper surfaces are flattened on the molecular scale by the chemical mechanical polishing (CMP) method, which is used in the fabrication of semiconductors. In particular, we examined whether even pure water affects the properties of si...
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 26(2010), 19 vom: 05. Okt., Seite 15310-5 |
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| Format: | Online-Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2010
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids |
| Schlagworte: | Journal Article |
| Online verfügbar |
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