Fabrication of copper damascene patterns on polyimide using direct metallization on trench templates generated by imprint lithography

Facile imprint and wet chemical processes were used to fabricate copper damascene patterns on polyimide substrate. Poly(amic acid) substrate with trench structures as template has been successfully prepared by imprint lithography using a poly(dimethylsiloxane) mold. The doped Ni(2+) ions into a temp...

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Veröffentlicht in:	Langmuir : the ACS journal of surfaces and colloids. - 1992. - 26(2010), 14 vom: 20. Juli, Seite 12448-54
1. Verfasser:	Matsumura, Yasufumi (VerfasserIn)
Weitere Verfasser:	Enomoto, Yasushi, Tsuruoka, Takaaki, Akamatsu, Kensuke, Nawafune, Hidemi
Format:	Online-Aufsatz
Sprache:	English
Veröffentlicht:	2010
Zugriff auf das übergeordnete Werk:	Langmuir : the ACS journal of surfaces and colloids
Schlagworte:	Journal Article Benzene Derivatives Dimethylpolysiloxanes Polymers polyamic acid baysilon 63148-62-9 Copper 789U1901C5 Nickel 7OV03QG267