Kinetics of electroless deposition : the copper-dimethylamine borane system
A kinetic study of the electroless deposition of copper on gold, using dimethylamine borane (DMAB) as a reducing agent, has been carried out. The copper deposition rate in the electroless bath was determined to be 50 nm min(-1), through electrochemical stripping of the copper deposits as well as fro...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 26(2010), 12 vom: 15. Juni, Seite 10334-40
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| 1. Verfasser: |
Plana, Daniela
(VerfasserIn) |
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| Weitere Verfasser: |
Campbell, Andrew I,
Patole, Samson N,
Shul, Galyna,
Dryfe, Robert A W |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2010
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids
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| Schlagworte: | Journal Article |
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