Wafer-bonded 2-D CMUT arrays incorporating through-wafer trench-isolated interconnects with a supporting frame
This paper reports on wafer-bonded, fully populated 2-D capacitive micromachined ultrasonic transducer (CMUT) arrays. To date, no successful through-wafer via fabrication technique has been demonstrated that is compatible with the wafer-bonding method of making CMUT arrays. As an alternative to thro...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 56(2009), 1 vom: 01. Jan., Seite 182-92
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| 1. Verfasser: |
Zhuang, Xuefeng
(VerfasserIn) |
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| Weitere Verfasser: |
Wygant, Ira O,
Lin, Der-Song,
Kupnik, Mario,
Oralkan, Omer,
Khuri-Yakub, Butrus T |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2009
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| Zugriff auf das übergeordnete Werk: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Schlagworte: | Journal Article
Research Support, N.I.H., Extramural
Research Support, Non-U.S. Gov't
Research Support, U.S. Gov't, Non-P.H.S.
Soybean Oil
8001-22-7
Silicon
Z4152N8IUI |
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