Evaluation of wafer bonded CMUTs with rectangular membranes featuring high fill factor
Increasing fill factor is one design approach used to increase average output displacement, output pressure, and sensitivity of capacitive micromachined ultrasonic transducers (CMUTs). For rectangular cells, the cell-to-cell spacing and the aspect ratio determine the fill factor. In this paper, we e...
Ausführliche Beschreibung
Bibliographische Detailangaben
| Veröffentlicht in: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 55(2008), 9 vom: 15. Sept., Seite 2053-65
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| 1. Verfasser: |
Wong, Serena H
(VerfasserIn) |
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| Weitere Verfasser: |
Kupnik, Mario,
Zhuang, Xuefeng,
Lin, Der-Song,
Butts-Pauly, Kim,
Khuri-Yakub, Butrus T |
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| Format: | Online-Aufsatz
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| Sprache: | English |
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| Veröffentlicht: |
2008
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| Zugriff auf das übergeordnete Werk: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Schlagworte: | Evaluation Study
Journal Article
Research Support, N.I.H., Extramural
Membranes, Artificial |
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