Application of direct covalent molecular assembly in the fabrication of polyimide ultrathin films
Ultrathin films were fabricated using synthesized hydroxyl polyimide (HPI) in a layer-by-layer fashion on amine-terminated substrates of silicon, quartz, and gold. The interlayer linkages were established by using terephthaloyl chloride as a bridging agent to form ester groups between HPI layers. Fo...
| Veröffentlicht in: | Langmuir : the ACS journal of surfaces and colloids. - 1992. - 21(2005), 8 vom: 12. Apr., Seite 3389-95 |
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| Format: | Aufsatz |
| Sprache: | English |
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2005
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| Zugriff auf das übergeordnete Werk: | Langmuir : the ACS journal of surfaces and colloids |
| Schlagworte: | Journal Article |