In situ study of colloid crystallization in constrained geometry

We visualized in real time electrodeposition-driven colloid crystal growth on patterned conductive surfaces. The electrode was patterned with dielectric ribs and conductive grooves; the groove width was commensurate or incommensurate with a two-dimensional colloid crystal lattice. Electrodeposition...

Ausführliche Beschreibung

Bibliographische Detailangaben
Veröffentlicht in:Langmuir : the ACS journal of surfaces and colloids. - 1999. - 20(2004), 4 vom: 17. Feb., Seite 1414-9
1. Verfasser: Golding, Robert Kori (VerfasserIn)
Weitere Verfasser: Lewis, Patrick C, Kumacheva, Eugenia, Allard, Mathieu, Sargent, Edward H
Format: Aufsatz
Sprache:English
Veröffentlicht: 2004
Zugriff auf das übergeordnete Werk:Langmuir : the ACS journal of surfaces and colloids
Schlagworte:Journal Article
Beschreibung
Zusammenfassung:We visualized in real time electrodeposition-driven colloid crystal growth on patterned conductive surfaces. The electrode was patterned with dielectric ribs and conductive grooves; the groove width was commensurate or incommensurate with a two-dimensional colloid crystal lattice. Electrodeposition was carried out against gravity to decouple sedimentation and electrodeposition of colloid particles. Our experiments reveal the following: (i) Colloid crystal growth occurs under the action of electrohydrodynamic forces, in contrast with colloid assembly under the action of capillary forces. (ii) Confinement of the colloid arrays reduces the size of particle clusters. Small clusters easily undergo structural rearrangements to produce close-packed crystals when the groove width is commensurate or nearly commensurate with the 2D lattice. (iii) Incommensurability between the two-dimensional crystalline lattice and the groove width exceeding ca. 15% leads to the formation of non-close-packed structures and the distortion of colloid arrays
Beschreibung:Date Completed 26.01.2006
Date Revised 26.10.2019
published: Print
Citation Status PubMed-not-MEDLINE
ISSN:1520-5827