Trace element analysis on Si wafer surfaces by TXRF at the ID32 ESRF undulator beamline

Synchrotron radiation total-reflection X-ray fluorescence (SR-TXRF) has been applied to the impurity analysis of Si wafers using a third-generation synchrotron radiation undulator source. A lower limit of detectability (LLD) for Ni atoms of 17 fg (1.7 x 10(8) atoms cm(-2)) has been achieved with an...

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Veröffentlicht in:Journal of synchrotron radiation. - 1994. - 5(1998), Pt 3 vom: 01. Mai, Seite 1064-6
1. Verfasser: Ortega, L (VerfasserIn)
Weitere Verfasser: Comin, F, Formoso, V, Stierle, A
Format: Aufsatz
Sprache:English
Veröffentlicht: 1998
Zugriff auf das übergeordnete Werk:Journal of synchrotron radiation
Schlagworte:Journal Article
Beschreibung
Zusammenfassung:Synchrotron radiation total-reflection X-ray fluorescence (SR-TXRF) has been applied to the impurity analysis of Si wafers using a third-generation synchrotron radiation undulator source. A lower limit of detectability (LLD) for Ni atoms of 17 fg (1.7 x 10(8) atoms cm(-2)) has been achieved with an optical set-up based on an Si(111) double-crystal monochromator and a horizontal sample geometry. These first results are very promising for synchrotron radiation trace element analysis since we estimate that it is possible to lower the LLD by a factor of about 25 by employing appropriate optics and detectors. The use of a crystal monochromator opens new possibilities to perform absorption and scattering experiments (NEXAFS and X-ray standing-wave methods) for chemical and structural analysis of ultratrace elements
Beschreibung:Date Completed 02.10.2012
Date Revised 20.07.2004
published: Print-Electronic
Citation Status PubMed-not-MEDLINE
ISSN:1600-5775