A preliminary study on electrically enhanced crossflow microfiltration of CMP (chemical-mechanical polishing) wastewater
Chemical-mechanical polishing (CMP) is currently one of the main technologies used by wafer plants in the semiconductor industry. Normally, a large amount of de-ionized water should be used to wash out the abrasives adhered to the surface of wafers during the grinding process. Therefore, CMP wastewa...
| Veröffentlicht in: | Water science and technology : a journal of the International Association on Water Pollution Research. - 1986. - 46(2002), 11-12 vom: 01., Seite 171-6 |
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| Format: | Aufsatz |
| Sprache: | English |
| Veröffentlicht: |
2002
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| Zugriff auf das übergeordnete Werk: | Water science and technology : a journal of the International Association on Water Pollution Research |
| Schlagworte: | Journal Article Research Support, Non-U.S. Gov't Industrial Waste |