APA Zitierstil

Yamaoka, K., Wada, T., Ogasa, I., Komyo, T., Luo, C., Ikura, R., . . . Takashima, Y. (2025). Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion. Advanced materials (Deerfield Beach, Fla.). https://doi.org/10.1002/adma.202507939

Chicago Zitierstil

Yamaoka, Kenji, et al. "Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion." Advanced Materials (Deerfield Beach, Fla.) 2025. https://dx.doi.org/10.1002/adma.202507939.

MLA Zitierstil

Yamaoka, Kenji, et al. "Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion." Advanced Materials (Deerfield Beach, Fla.), 2025.