Yu, R., Wu, L., Yang, Z., Wu, J., Chen, H., Pan, S., & Zhu, M. (2025). Dynamic Liquid Metal-Microfiber Interlocking Enables Highly Conductive and Strain-insensitive Metastructured Fibers for Wearable Electronics. Advanced materials (Deerfield Beach, Fla.), 37(6), . https://doi.org/10.1002/adma.202415268
Chicago ZitierstilYu, Rouhui, Liang Wu, Zhonghua Yang, Jin Wu, Huifang Chen, Shaowu Pan, und Meifang Zhu. "Dynamic Liquid Metal-Microfiber Interlocking Enables Highly Conductive and Strain-insensitive Metastructured Fibers for Wearable Electronics." Advanced Materials (Deerfield Beach, Fla.) 37, no. 6 (2025). https://dx.doi.org/10.1002/adma.202415268.
MLA ZitierstilYu, Rouhui, et al. "Dynamic Liquid Metal-Microfiber Interlocking Enables Highly Conductive and Strain-insensitive Metastructured Fibers for Wearable Electronics." Advanced Materials (Deerfield Beach, Fla.), vol. 37, no. 6, 2025.