Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXeneAg Composites Achieved by In Situ Sintering of Silver Nanoparticles
The growing use of high-power and integrated electronic devices has created a need for thermal conductive adhesives (TCAs) with high thermal conductivity (TC) to manage heat dissipation at the interface. However, TCAs are often limited by contact thermal resistance at the interface between materials...
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Détails bibliographiques
| Publié dans: | Langmuir : the ACS journal of surfaces and colloids. - 1985. - 40(2024), 23 vom: 11. Juni, Seite 12059-12069
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| Auteur principal: |
Chen, Tao
(Auteur) |
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| Autres auteurs: |
Liu, Li,
Han, Liping,
Yu, Xianglei,
Tang, Xianjie,
Li, Weichao,
Qian, Zhuo,
Li, Junpeng,
Gan, Guoyou |
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| Format: | Article en ligne
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| Langue: | English |
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| Publié: |
2024
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| Accès à la collection: | Langmuir : the ACS journal of surfaces and colloids
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| Sujets: | Journal Article |
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