Huang, J., Deng, Y., Han, Y., Shu, J., Wang, R., Huang, S., . . . Chen, M. (2022). Toxic footprint and materials profile of electronic components in printed circuit boards. Waste management (New York, N.Y.), 141, 154. https://doi.org/10.1016/j.wasman.2022.01.019
Style de citation ChicagoHuang, Jinfeng, et al. "Toxic Footprint and Materials Profile of Electronic Components in Printed Circuit Boards." Waste Management (New York, N.Y.) 141 (2022): 154. https://dx.doi.org/10.1016/j.wasman.2022.01.019.
Style de citation MLAHuang, Jinfeng, et al. "Toxic Footprint and Materials Profile of Electronic Components in Printed Circuit Boards." Waste Management (New York, N.Y.), vol. 141, 2022, p. 154.
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