Chen, M., Yang, F., Chen, X., Qin, R., Pi, H., Zhou, G., & Yang, P. (2021). Crack Suppression in Conductive Film by Amyloid-Like Protein Aggregation toward Flexible Device. Advanced materials (Deerfield Beach, Fla.), 33(44), . https://doi.org/10.1002/adma.202104187
Style de citation ChicagoChen, Mengmeng, Facui Yang, Xi Chen, Rongrong Qin, Hemu Pi, Guijiang Zhou, et Peng Yang. "Crack Suppression in Conductive Film by Amyloid-Like Protein Aggregation Toward Flexible Device." Advanced Materials (Deerfield Beach, Fla.) 33, no. 44 (2021). https://dx.doi.org/10.1002/adma.202104187.
Style de citation MLAChen, Mengmeng, et al. "Crack Suppression in Conductive Film by Amyloid-Like Protein Aggregation Toward Flexible Device." Advanced Materials (Deerfield Beach, Fla.), vol. 33, no. 44, 2021.