Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics
This article presents a thermal control design method for a surface acoustic wave (SAW) device. We designed a heat-dissipation structure and packaging scheme to solve three key issues observed in SAW devices using anisotropic crystals as piezoelectric substrates in acoustofluidics (e.g., lithium nio...
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Détails bibliographiques
| Publié dans: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control. - 1986. - 69(2022), 1 vom: 15. Jan., Seite 386-398
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| Auteur principal: |
Han, Junlong
(Auteur) |
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| Autres auteurs: |
Yang, Fan,
Hu, Hong,
Huang, Qingyun,
Lei, Yulin,
Li, MingYu |
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| Format: | Article en ligne
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| Langue: | English |
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| Publié: |
2022
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| Accès à la collection: | IEEE transactions on ultrasonics, ferroelectrics, and frequency control
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| Sujets: | Journal Article
Research Support, Non-U.S. Gov't |
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