APA Zitierstil

Han, J., Yang, F., Hu, H., Huang, Q., Lei, Y., & Li, M. (2022). Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics. IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 69(1), 386. https://doi.org/10.1109/TUFFC.2021.3101248

Chicago Zitierstil

Han, Junlong, Fan Yang, Hong Hu, Qingyun Huang, Yulin Lei, und MingYu Li. "Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics." IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control 69, no. 1 (2022): 386. https://dx.doi.org/10.1109/TUFFC.2021.3101248.

MLA Zitierstil

Han, Junlong, et al. "Thermal Control Design and Packaging for Surface Acoustic Wave Devices in Acoustofluidics." IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 69, no. 1, 2022, p. 386.