Han, T., Yang, P., Li, Y., Lei, D., Li, B., Hippalgaonkar, K., & Qiu, C. (2018). Full-Parameter Omnidirectional Thermal Metadevices of Anisotropic Geometry. Advanced materials (Deerfield Beach, Fla.), 30(49), . https://doi.org/10.1002/adma.201804019
Style de citation ChicagoHan, Tiancheng, Peng Yang, Ying Li, Dangyuan Lei, Baowen Li, Kedar Hippalgaonkar, et Cheng-Wei Qiu. "Full-Parameter Omnidirectional Thermal Metadevices of Anisotropic Geometry." Advanced Materials (Deerfield Beach, Fla.) 30, no. 49 (2018). https://dx.doi.org/10.1002/adma.201804019.
Style de citation MLAHan, Tiancheng, et al. "Full-Parameter Omnidirectional Thermal Metadevices of Anisotropic Geometry." Advanced Materials (Deerfield Beach, Fla.), vol. 30, no. 49, 2018.
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