Song, J., Li, J., Xu, L., Li, J., Zhang, F., Han, B., . . . Zeng, H. (2018). Room-Temperature Triple-Ligand Surface Engineering Synergistically Boosts Ink Stability, Recombination Dynamics, and Charge Injection toward EQE-11.6% Perovskite QLEDs. Advanced materials (Deerfield Beach, Fla.), 30(30), . https://doi.org/10.1002/adma.201800764
Style de citation ChicagoSong, Jizhong, Jinhang Li, Leimeng Xu, Jianhai Li, Fengjuan Zhang, Boning Han, Qingsong Shan, et Haibo Zeng. "Room-Temperature Triple-Ligand Surface Engineering Synergistically Boosts Ink Stability, Recombination Dynamics, and Charge Injection Toward EQE-11.6% Perovskite QLEDs." Advanced Materials (Deerfield Beach, Fla.) 30, no. 30 (2018). https://dx.doi.org/10.1002/adma.201800764.
Style de citation MLASong, Jizhong, et al. "Room-Temperature Triple-Ligand Surface Engineering Synergistically Boosts Ink Stability, Recombination Dynamics, and Charge Injection Toward EQE-11.6% Perovskite QLEDs." Advanced Materials (Deerfield Beach, Fla.), vol. 30, no. 30, 2018.