Zhou, Y., Wu, W., & Qiu, K. (2011). Recycling of organic materials and solder from waste printed circuit boards by vacuum pyrolysis-centrifugation coupling technology. Waste management (New York, N.Y.), 31(12), 2569. https://doi.org/10.1016/j.wasman.2011.07.002
Style de citation ChicagoZhou, Yihui, WenBiao Wu, et Keqiang Qiu. "Recycling of Organic Materials and Solder from Waste Printed Circuit Boards by Vacuum Pyrolysis-centrifugation Coupling Technology." Waste Management (New York, N.Y.) 31, no. 12 (2011): 2569. https://dx.doi.org/10.1016/j.wasman.2011.07.002.
Style de citation MLAZhou, Yihui, et al. "Recycling of Organic Materials and Solder from Waste Printed Circuit Boards by Vacuum Pyrolysis-centrifugation Coupling Technology." Waste Management (New York, N.Y.), vol. 31, no. 12, 2011, p. 2569.