Fu, Y., Qin, Y., Wang, T., Chen, S., & Liu, J. (2010). Ultrafast transfer of metal-enhanced carbon nanotubes at low temperature for large-scale electronics assembly. Advanced materials (Deerfield Beach, Fla.), 22(44), 5039. https://doi.org/10.1002/adma.201002415
Chicago ZitierstilFu, Yifeng, Yiheng Qin, Teng Wang, Si Chen, und Johan Liu. "Ultrafast Transfer of Metal-enhanced Carbon Nanotubes at Low Temperature for Large-scale Electronics Assembly." Advanced Materials (Deerfield Beach, Fla.) 22, no. 44 (2010): 5039. https://dx.doi.org/10.1002/adma.201002415.
MLA ZitierstilFu, Yifeng, et al. "Ultrafast Transfer of Metal-enhanced Carbon Nanotubes at Low Temperature for Large-scale Electronics Assembly." Advanced Materials (Deerfield Beach, Fla.), vol. 22, no. 44, 2010, p. 5039.