Quan, C., Li, A., & Gao, N. (2009). Thermogravimetric analysis and kinetic study on large particles of printed circuit board wastes. Waste management (New York, N.Y.), 29(8), 2353. https://doi.org/10.1016/j.wasman.2009.03.020
Style de citation ChicagoQuan, Cui, Aimin Li, et Ningbo Gao. "Thermogravimetric Analysis and Kinetic Study on Large Particles of Printed Circuit Board Wastes." Waste Management (New York, N.Y.) 29, no. 8 (2009): 2353. https://dx.doi.org/10.1016/j.wasman.2009.03.020.
Style de citation MLAQuan, Cui, et al. "Thermogravimetric Analysis and Kinetic Study on Large Particles of Printed Circuit Board Wastes." Waste Management (New York, N.Y.), vol. 29, no. 8, 2009, p. 2353.
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